International Welding &
Joining Conference - Korea2017

April 11 ~ 14, 2017 HICO, Gyeongju, Korea

Important Dates

  • Final Extended Abstracts Submission Due : January 25, 2017
  • Notification of Acceptance : February 10, 2017
  • Early Registration Due : March 15, 2017

Invited Speakers

Scope 1. Smart Welding Process Speaker's Short Bio

Invited 1 Manabu Tanaka
Title : Towards Smart Arc Welding Process through Visualizations
JWRI, JAPAN

Scope 2. Metallurgy/Weldability/Filler Metals Speaker's Short Bio

Invited 1 Kazuyoshi Saida
Title : Modeling and Simulation of Metallurgical Phenomena in Welds
Osaka University, JAPAN
Invited 2 Yoshihiko Kitagawa
Title : Improvement of notch toughness after PWHT for HSLA weld metals with rutile-type flux-cored wire
Kobe Steel, JAPAN

Scope 3. Residual Stress/Distortion/Modeling Speaker's Short Bio

Invited 1 Dean Deng
Title : Predicting welding distortion of thin-plate structures by means of inherent strain method and interface element
Chongqing University, CHINA
Invited 2 Mikihito Hirohata
Title : Welding Residual Stress Release by Local Heat Treatment on Bridge Structural Members
Nagoya University, JAPAN
Invited 3 Myung Hyun Kim
Title : Review of Fatigue and Fracture Performances of Low Temperature Materials for LNG Storage Systems
Pusan National University, KOREA

Scope 4. Welding Strength/Integrity Speaker's Short Bio

Invited 1 William Mohr
Title : Brittle Fracture Resistance of Offshore Steels Below Their Design Temperatures
EWI, USA
Invited 2 Chang-li Yu
Title : Study on ultimate strength assessment approach of welding structure and its application on spherical shells
Harbin Institute of Technology at Weihai, CHINA
Invited 3 Gyubaek An
Title : A state of the art unstable fracture in shipbuilding weld joints
Chosun University, KOREA

Scope 5. Additive Manufacturing/Surface Modification Speaker's Short Bio

Invited 1 Mathieu Terner
Title : The prospect of Metal Additive Manufacturing for the Aerospace Industry
Changwon University, Korea
Invited 2 Stefan Richardt
Title : Pioneers in the Laser Melting of Metals
Conceptlaser, GERMANY

Scope 6. Laser/Electron Beam Welding Speaker's Short Bio

Invited 1 Tony Hoult
Title : Welding problem materials with continuous wave Ytterbium fiber lasers.
CIPG Technology, USA
Invited 2 Li Zhuguo
Title : Hot cracking phenomena and control methods during laser additive manufacturing of Inconel 718 alloy
Shanghai Jiao Tong University, CHINA
Invited 3 Cheolhee Kim
KITECH, KOREA

Scope 7. Friction Stir Welding Speaker's Short Bio

Invited 1 Hee-Seon Bang
Title : Influence of Preheating Source on Weldability of Dissimilar Materials by Hybrid Friction Stir Welding
Chosun University, KOREA
Invited 2 Heungnam Han
Title : A numerical modeling of friction stir welding in steel considering phase transformation
Seoul National University, KOREA
Invited 3 Yutaka Sato
Tohoku University, JAPAN

Scope 8. Electrical Resistance Welding Speaker's Short Bio

Invited 1 Yansong Zhang
Title : Resistance spot welding and weld-bonding of multiple stacks of steel sheets.
Shanghai Jiao Tong University, CHINA
Invited 2 Muneo Matsushita
JFE Steel, JAPAN

Scope 9. Sensing/Monitoring/Automation Speaker's Short Bio

Invited 1 Sang-Myung Cho
Title : Innovation of Productivity in the Automatic TIG Welding
Pukyong National University, KOREA
Invited 2 Young Whan Park
Title : Metal transfer classification by ARMA model and weldability evaluation in Aluminum MIG welding
Pukyong National University, KOREA

Scope 10. Advanced Package Materials/Interconnection Speaker's Short Bio

Invited 1 Kaichi Tsuruta
Title : Cu Core ball Soldering for Semiconductor
Senju Metal Industry Co.,Ltd, JAPAN
Invited 2 Seung-Boo Jung
Title : Fabrication of Ag nanocomposite paste for high-reliable bonding Materials
Sungkyunkwan University, KOREA

Scope 11. Sintering/TLP/Diffusion/Soldering/Brazing Speaker's Short Bio

Invited 1 Shijo Nagao
Title : Metal-paste sintering die-attach for high temperature power devices
Osaka University, JAPAN
Invited 2 Rajkumar Durairaj
Title : Development of Graphene filled Isotropic Conductive Adhesives (ICAs) for Electronic Packaging Applications
UniversitiTunku Abdul Rahman (UTAR), MALAYSIA

Scope 12. Nano/Micro Joining in Smart Wearable Device Speaker's Short Bio

Invited 1 Hiroshi Nishikawa
Title : Novel soldering process using localized heating methods for wearable devices
Osaka University, JAPAN
Invited 2 Suck-Won Hong
Title : A transparent, flexible, and stretchable electrode arrays for electronic circuit based on lithographically patterned Ag thin film
Pusan National University, KOREA

Scope 13. Pressure Speaker's Short Bio

Invited 1 Ho-Sang Shin
Korea Institute of Nuclear Safety, KOREA

Scope 14. Inspection/Evaluation/Qualification Speaker's Short Bio

Invited 1 Wan Chuck Woo
Title : Destructive and non-destructive measurements of residual stresses in thick FCAW, EGW, dissimilar, and LTT welds
Korea Atomic Energy Research Institute, KOREA
Invited 2 Youn Ho Cho
Title : Weld inspection by Advanced Ultrasonic Waves: Applications on nuclear reactor and offshore plant
Pusan National University, KOREA